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RoHS ´ë»óǰ¸ñ ¿¹¿ÜÁ¶Ç× Ãß°¡ 2007-02-22
21. Lead and cadmium in printing inks for the application of enamels on borosilicate glass.

(borosilicate À¯¸®¿¡ ¿¡³ª¸á ÄÚÆÃ¿ë ÀμâÀ×Å©ÀÇ ³³°ú Ä«µå¹Å)




22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems

(±¤Åë½Å½Ã½ºÅÛ¿¡ »ç¿ëµÇ´Â RIG Faraday rotatorÀÇ ºÒ¼ø¹°·Î¼­ÀÇ ³³)




23. Lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other than connectors with a pitch of 0.65 mm or less with copper lead-frames.

(¹Ì¼¼ÇÇÄ¡ºÎǰ ¸¶°¨Àç¿¡ ÇÔÀ¯µÈ ³³À¸·Î, NiFe ¸®µå-ÇÁ·¹ÀÓÀ̳ª ±¸¸®-¸®µåÇÁ·¹ÀÓÀ¸·Î µÈ, 0.65mm ÀÌÇÏ °£°ÝÀÇ Ä¿³ØÅÍ´Â Á¦¿ÜÇÔ)




24. Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors

(¿ø¹ÝÇü°ú Æò¸éÇü ¾î·¹ÀÌ ¼¼¶ó¹Í ÀûÃþ ijÆÐ½ÃÅÍÀÇ ±¸¸ÛÀ» ÅëÇØ ±â°è ³³¶«Çϱâ À§ÇÑ ³³¶« ¼ÓÀÇ ³³)




25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays (SED) used in structural elements notably in the front and rear glass dielectric layer, the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal frit and frit ring as well as in print pastes.

(PDP ¹× SED¿¡¼­ »ç¿ëµÇ´Â »êÈ­³³À¸·Î ÁÖ·Î Àü¸é°ú ÈĸéÀÇ À¯ÀüÁ¦Ãþ, ¹ö½ºÀü±Ø, the black stripe, ¾îµå·¹½º Àü±Ø, °Ýº®, the seal frit and frit ring°ú Àμâ¿ë ÆäÀ̽ºÆ®¿¡ »ç¿ëµÇ´Â »êÈ­³³)




26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.

(BLB lampÀÇ À¯¸® ºÀÇÕÁ¦¿¡¼­ÀÇ »êÈ­³³)




27. Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers.

(125 µ¥½Ãº§ À̻󿡼­ ¼ö±â°£ µ¿¾È ÀÛµ¿ÇÏ´Â °­·Â À½Ç⽺ÇÇÄ¿¿ë transducerÀÇ ³³¶«¿¡ ÇÔÀ¯µÈ ÇÕ±Ý ³³)




28. Hexavalent chromium in corrosive preventive coatings of unpainted metal sheetings and fasteners used for corrosion protection and Electromagnetic Interference Shielding in equipment falling under category three of Directive 2002/96/EC (IT and telecommunications equipment). Exemption granted until 1 July 2007."

(2002/96/ECÀÇ ºÐ·ù 3¿¡ ÇØ´çµÇ´Â ±â±¸¿¡ »ç¿ëµÇ´Â ÀüÀÚÆÄ Â÷´Ü¸·°ú ºÎ½Ä¹æÁö¿¡ »ç¿ëµÇ´Â ÆäÀÎÆ®Ä¥À» ÇÏÁö ¾ÊÀº ±Ý¼ÓÆÇ°ú ÆÄ½º³Ê¿¡ »ç¿ëµÇ´Â ºÎ½Ä¹æÁöÄÚÆÃÀÇ 6°¡ Å©·Ò. ÀÌ ¿¹¿Ü´Â 2007³â 7¿ù 1ÀϱîÁö ÀÎÁ¤µÊ)




29. Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC OJ L 326 , 29.12.1969, p. 36. Directive as last amended by 2003 Act of Accession.

(69/493/EEC ºÎ¼Ó¼­ 1¿¡ ±ÔÁ¤µÈ Å©¸®½ºÅ» À¯¸®¿¡ ÇÔÀ¯µÈ ³³)




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